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SURFACE FINISHING CHEMISTRY

Electroplating
Intermediates & Additives

Reliable chemistry for copper plating, nickel plating and copper foil applications.

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Better Surfaces. Brighter Tomorrow.

Reliable QualityConsistent performance
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R&D CapabilityApplication-focused chemistry
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What We Make

High-performance intermediates and additives for a wide range of electroplating applications.

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Electroplating Intermediates

Key chemistries for copper plating, nickel plating, chromium-related and specialty plating processes.

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Electroplating Additives

Brighteners and process additives for stable, high-quality finishing.

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Specialty Chemistry

Solutions for evolving surface finishing needs.

Featured Chemistry

A KEY BUILDING BLOCK FOR BETTER SURFACES
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SPS

Bis-(sodium sulfopropyl)-disulfide

Grain refiner for acid copper plating, printed circuit boards and electrolytic copper foil.

  • Copper grain refinement
  • Helps prevent high-current-density burning
  • Suitable for dye and non-dye additive systems
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Our Chemistry Portfolio

A focused portfolio to support your surface finishing success.

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Specialty Chemistry

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From Laboratory to Production

Application guidance, formulation support and process troubleshooting to help you achieve better and more consistent results.

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About Mengde

Jiangsu Mengde specializes in the research, development and manufacture of electroplating intermediates and additives, supporting customers with specialty chemistry and technical guidance.

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Mengde manufacturing facility
Founded in 1996Experience in specialty chemistry
ISO 9001:2015Quality management system
R&D + ManufacturingIntegrated capabilities
Global Customer SupportDiscuss your application with us

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Industry knowledge. Practical experience. Better surfaces.

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Updates from Mengde and the surface finishing industry.

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Looking for the right chemistry for your plating process?

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Talk to Our Technical TeamBETTER SURFACES. BRIGHTER TOMORROW.